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101 - Fabrication
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Principles and Practices
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schedule
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rights and responsibilities
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assignment
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Project Management
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synchronization
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version control
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Web development
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blogs, wikis, content management systems
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security
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videoconference
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protocols
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codecs
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Multipoint Control Unit (MCU)
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clients
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software
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hardware
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remote desktop
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project management programs
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project management principles
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demand- vs supply-side time management
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serial vs parallel development
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spiral development
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bottom-up vs top-down debugging
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hierarchy, modularity
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assignment
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build a personal site in the class archive describing you and your final project
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Introduction to Materials and Properties
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physical properties
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chemical properties
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mechanical properties
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electrical properties
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thermal properties
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other design properties
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Computer-Aided Design
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2D design
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2.5D
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raster
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draw, scan, picture
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vector
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3D design
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Constructive Solid Geometry, hierarchical, parametric, procedural
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boundary (b-rep), function (f-rep) representations
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GUIs, scripting, hardware description languages
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declarative, constraint, optimization
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programs
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audio, video
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assignment
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model (draw, render, animate, simulate, ...) a possible final project, and post it on your class page
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Computer-Controlled Cutting
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tools
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knife
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laser
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waterjet
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hot wire
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wire EDM
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printer drivers
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applications
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signs
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pop-up cards, books
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screen printing
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flex, multi-layer circuits
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antennas
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knives
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vinyl
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masking tape
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transfer adhesive
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copper
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epoxy film
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(carpet tape)
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(sandblast stencil)
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settings
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force
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speed
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cut depth
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temperature, humidity, ...
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rollers, feeding
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weeding
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adhesion
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lift vs shear
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lasercutter
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applications
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marking, engraving
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raster
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vector
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screen printing
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press-fit construction
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stick-slip, bistability
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clearance
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chamfer
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parametric design
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Light Amplification by Stimulated Emission of Radiation
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state diagram
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population inversion
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gain medium
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lasing threshold
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output coupling
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beam mode, profile, waist
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diffraction limit
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gain medium
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CO2 (10.6 u)
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InGaAsP (1-2 u)
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AlGaAs (600-900 nm)
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Nd:YAG (1064, 532 nm)
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Ti:sapphire (650-1100 nm)
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excimer (100-300 nm)
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cutting mechanisms
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burning
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melting
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evaporation
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ablation
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airflow
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kerf
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models
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Class 1
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venting
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cleaning optics
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supervision
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air/gas flow
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fires
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materials
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Edge Crush Test (ECT) 44
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[polycarbonate]
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[metal]
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PVC
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flame test
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settings
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power
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speed
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rate
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coordinate system, origin
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vector, raster
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assignment
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3D Scanning and Printing
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additive vs subtractive processes
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printing
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constraints
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materials
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ABS, HIPS, acrylic, PLA, ...
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resolution
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time
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cost
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supports
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post-processing
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wall and edge thickness
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processes
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machines
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file formats
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STL
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ASCII
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solid object_name
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facet normal n1 n2 n3
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outer loop
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vertex v11 v12 v13
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vertex v21 v22 v23
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vertex v31 v32 v33
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endloop
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endfacet
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...
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endsolid object_name
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binary
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80 byte ASCII header
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32-bit integer number of facets
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50 byte facet records
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32-bit IEEE floats
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normal
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vertices 1,2,3
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2 byte attribute
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right hand rule
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normal (optional)
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FREP, BREP
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volumetric
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.vol, .tiff, .gif
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software
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scanning
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point cloud, triangulation, watertight, texture
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assignment
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* design and 3D print an object (small, few cm) that could not be made subtractively
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* 3D scan an object
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- extra credit: print the object
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- extra credit: make the scanner
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Computer-Controlled Machining
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machines
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stock
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rigid foam insulation (gesso, heat gun)
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veneer plywood
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medium density fiberboard (MDF)
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medium density overlay (MDO)
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oriented strand board (OSB)
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aluminum
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Lexan, polycarbonate
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glass
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vendors
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drill bits vs end mills
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flutes
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coatings
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center-cutting
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up/down cut
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flat/ball end
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chip load: ~ 0.001-0.010" feed rate (inches per minute) / (RPM x number of flutes)
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cut depth: ~ tool diameter
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step-over: ~ tool diameter/2
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fixturing
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vises
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clamps
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screws
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vacuum
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tabs
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weights
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adhesives
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encapsulation
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toolpaths
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kerf, offset, runout
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conventional, climb
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2, 2.5, 3, 3+2, 5
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cut depth, clearance, collisions
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t-bones
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lead-in, -out
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test cuts, cutting air
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file formats
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cuts, burns, impacts, fires
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glasses, shoes, clothes, hair
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emergency stop, assistance
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welding
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arc
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MIG (metal inert gas)
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TIG (tungsten inert gas)
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spot
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friction
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ultrasonic
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assignment
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Molding and Casting
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types
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injection (sprue, runner, gate, vent, parting line, flashing)
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insert
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vacuum
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blow
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flexible, soft
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PDMS (polydimethylsiloxane)
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calcium sulfate
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desicant, coagulant, plaster, gypsum, drywall
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Portland cement
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calcium silicate, aluminum/iron oxide, calcium sulfate
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fibers (tension, compression, composites)
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fillers: density, conductivity, flexibility, color, ...
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processing
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testing
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mixing
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pouring
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starting
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filling
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vent location
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curing
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polymerization
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cross-linking
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hydration
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endothermic, exothermic
|
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demolding
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taper
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release agents
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deformation
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storage
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shelf life
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safety
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ventilation
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protection
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disposal
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software
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assignment
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|
|
design a 3D mold, machine it, and cast parts from it
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Composites
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materials
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compression vs tension
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epoxy + carbon fiber
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concrete + rebar
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fiberglass
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FR1, FR4
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tire
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adobe
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wood
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fiber
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chopped, filament, tape, fabric
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glass
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carbon
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aramid, Kevlar
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natural: cotton, silk, bamboo, wood, linen, burlap, ...
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matrix
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epoxy
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polyester
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phenolic
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urethane
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wax
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cement
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natural: plant resins, sugars, ...
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vendors
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design
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plies
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radius of curvature
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cores
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spar, rib, skin
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processes
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compaction, infusion, volume fraction
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open, closed mold
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wet lay-up, pre-preg, resin transfer
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autoclave
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|
pultrusion
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mold, release, laminate, core, peel ply, bleeder, breather, bag, sealant tape, pump
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clear coat
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molds
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safety
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particles, inhalation, rashes
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respirators, googles, gloves
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|
|
fumes, ventilation
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|
|
net-shape
|
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|
|
assignment
|
|
|
|
|
design and make a 3D mold (~ft2), and produce a fiber composite part in it
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Mechanical Design
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|
|
vendors
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|
|
|
stress-strain
|
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|
|
|
moduli
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|
|
|
|
elastic, plastic flow
|
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|
|
friction
|
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|
|
spalling
|
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|
|
hysteresis
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|
|
backlash
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|
flexure
|
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|
|
force loops
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|
|
elastic averaging
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|
|
kinematic coupling
|
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|
|
materials
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fasteners
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framing
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drive
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guide
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couplers
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bearings
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rotary
|
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cables
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liquids
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|
whippletree
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|
|
pantograph
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|
|
Sarrus
|
|
|
|
|
(instructor) assignment
|
|
|
|
|
design or modify a machine, making as many of the components as possible
|
|
|
|
|
document the group project and your individual contribution
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|
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|
|
make the passive parts and operate it manually
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|
|
(instructor) assignment
|
|
|
|
|
document the group project and your individual contribution
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|
Applications and Implications
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|
|
assignment
|
|
|
|
|
plan and document a final project that integrates the range of units covered:
|
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|
|
what will it do?
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|
who's done what beforehand?
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what materials and components will be required?
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where will they come from?
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how much will it cost?
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|
what parts and systems will be made?
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what processes will be used?
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what tasks need to be completed?
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what questions need to be answered?
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|
what is the schedule?
|
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|
|
how will it be evaluated?
|
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|
|
projects can be separate or joint, but need to show individual mastery of all of the skills
|
|
|
|
|
where possible, you should make rather than buy the parts of your project
|
|
|
|
|
Project Development
|
|
|
|
|
assignment
|
|
|
|
|
what tasks have been completed, and what tasks remain?
|
|
|
|
|
what has worked? what hasn't?
|
|
|
|
|
what questions need to be resolved?
|
|
|
|
|
what will happen when?
|
|
|
|
|
what have you learned?
|
|
|
|
|
documentation during development
|
|
|
|
|
demand- vs supply-side time management
|
|
|
|
|
spiral development
|
|
|
|
|
Project Presentation
|
|
|
|
|
assignment
|
|
|
|
|
document a final project that integrates the range of units covered, answering:
|
|
|
|
|
what does it do?
|
|
|
|
|
who's done what beforehand?
|
|
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|
what did you design?
|
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|
|
what materials and components were used?
|
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|
|
where did they come from?
|
|
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|
how much did they cost?
|
|
|
|
|
what parts and systems were made?
|
|
|
|
|
what processes were used?
|
|
|
|
|
what questions were answered?
|
|
|
|
|
how was it evaluated?
|
|
|
|
|
what are the implications?
|
|
|
|
|
projects can be separate or joint, but need to show individual mastery of all of the skills
|
|
|
|
|
where possible, you should make rather than buy the parts of your project
|
|
|
|
|
present your final project, weekly assignments, and tutorials
|
|
|
|
|
102 - Codes and controls
|
|
|
|
|
Principles and Practices
|
|
|
|
|
schedule
|
|
|
|
|
rights and responsibilities
|
|
|
|
|
assignment
|
|
|
|
|
Project Management
|
|
|
|
|
synchronization
|
|
|
|
|
version control
|
|
|
|
|
Web development
|
|
|
|
|
blogs, wikis, content management systems
|
|
|
|
|
security
|
|
|
|
|
videoconference
|
|
|
|
|
protocols
|
|
|
|
|
codecs
|
|
|
|
|
Multipoint Control Unit (MCU)
|
|
|
|
|
clients
|
|
|
|
|
software
|
|
|
|
|
hardware
|
|
|
|
|
remote desktop
|
|
|
|
|
project management programs
|
|
|
|
|
project management principles
|
|
|
|
|
demand- vs supply-side time management
|
|
|
|
|
serial vs parallel development
|
|
|
|
|
spiral development
|
|
|
|
|
bottom-up vs top-down debugging
|
|
|
|
|
hierarchy, modularity
|
|
|
|
|
assignment
|
|
|
|
|
build a personal site in the class archive describing you and your final project
|
|
|
|
|
Electricity, Computation, Systems
|
|
|
|
|
Electronics Production
|
|
|
|
|
PCB fabrication
|
|
|
|
|
etching
|
|
|
|
|
lithography, transfer
|
|
|
|
|
ferric/cupric chloride, ammonium/sodium persulfate
|
|
|
|
|
waste disposal
|
|
|
|
|
tools
|
|
|
|
|
fixturing
|
|
|
|
|
orientation
|
|
|
|
|
zeroing
|
|
|
|
|
lifetime
|
|
|
|
|
deburring
|
|
|
|
|
cleaning
|
|
|
|
|
plating
|
|
|
|
|
PCB materials
|
|
|
|
|
rigid
|
|
|
|
|
FR4 (epoxy glass)
|
|
|
|
|
flex
|
|
|
|
|
high-frequency
|
|
|
|
|
teflon
|
|
|
|
|
glass
|
|
|
|
|
copper
|
|
|
|
|
0.5 oz: 17.5 um
|
|
|
|
|
1.0 oz: 35 um
|
|
|
|
|
2.0 oz: 70 um
|
|
|
|
|
board houses
|
|
|
|
|
design rules
|
|
|
|
|
width/spacing (15, 5 mils)
|
|
|
|
|
layers
|
|
|
|
|
1, 1.5, 2, 4, N
|
|
|
|
|
solder mask, silk screen
|
|
|
|
|
vias
|
|
|
|
|
blind, buried
|
|
|
|
|
through-hole
|
|
|
|
|
surface-mount
|
|
|
|
|
chip-scale
|
|
|
|
|
assembly
|
|
|
|
|
solder
|
|
|
|
|
eutectic
|
|
|
|
|
wetting
|
|
|
|
|
flux
|
|
|
|
|
wire, paste, bar
|
|
|
|
|
manual, reflow, wave
|
|
|
|
|
stuffing
|
|
|
|
|
component orientation
|
|
|
|
|
tacking down parts
|
|
|
|
|
bottom to top, inside to outside
|
|
|
|
|
fumes
|
|
|
|
|
washing
|
|
|
|
|
desoldering
|
|
|
|
|
cutting traces, adding jumpers
|
|
|
|
|
encapsulation
|
|
|
|
|
CAM
|
|
|
|
|
assignment
|
|
|
|
|
make the FabISP in-circuit programmer
|
|
|
|
|
USB power
|
|
|
|
|
make clean
|
|
|
|
|
make hex
|
|
|
|
|
(sudo) make fuse (check programmer in Makefile, may need to repeat)
|
|
|
|
|
(sudo) make program
|
|
|
|
|
desolder SJ1 and SJ2
|
|
|
|
|
make IDC ISP cable, connecting header pin 1 to pin 1
|
|
|
|
|
Electronics Design
|
|
|
|
|
capacitor: C = Q/V, I = C dV/dt
|
|
|
|
|
diode: current from anode to cathode
|
|
|
|
|
PN
|
|
|
|
|
transistor
|
|
|
|
|
bipolar: collector, emitter, base current gain
|
|
|
|
|
mosfet: source, drain, gate resistance
|
|
|
|
|
op-amp: differential gain, negative feedback
|
|
|
|
|
Kirchoff's laws: sum current at node, voltage around loop = 0
|
|
|
|
|
power: P = I^2 R = I V
|
|
|
|
|
EDA
|
|
|
|
|
hierarchical, parametric drawing
|
|
|
|
|
packages, footprints, component libraries
|
|
|
|
|
design rules
|
|
|
|
|
schematic entry, component placement, routing, simulation, fabrication
|
|
|
|
|
drafting tape
|
|
|
|
|
assignment
|
|
|
|
|
add (at least) a button and LED (with current-limiting resistor),
|
|
|
|
|
check the design rules, and make it
|
|
|
|
|
Embedded Programming
|
|
|
|
|
architectures
|
|
|
|
|
Harvard, von Neumann
|
|
|
|
|
RISC, CISC
|
|
|
|
|
microprocessor, microcontroller
|
|
|
|
|
memory
|
|
|
|
|
registers
|
|
|
|
|
SRAM
|
|
|
|
|
DRAM
|
|
|
|
|
EEPROM
|
|
|
|
|
FLASH
|
|
|
|
|
fuse
|
|
|
|
|
peripherals
|
|
|
|
|
A/D
|
|
|
|
|
comparator
|
|
|
|
|
D/A
|
|
|
|
|
timer/counter/PWM
|
|
|
|
|
USART
|
|
|
|
|
USB
|
|
|
|
|
...
|
|
|
|
|
word size
|
|
|
|
|
families
|
|
|
|
|
vendors
|
|
|
|
|
AVR processors
|
|
|
|
|
packages
|
|
|
|
|
DIP
|
|
|
|
|
SOT
|
|
|
|
|
SOIC
|
|
|
|
|
TSSOP
|
|
|
|
|
TQFP
|
|
|
|
|
LQFP
|
|
|
|
|
clocks
|
|
|
|
|
RC (10%, 1% calibrated)
|
|
|
|
|
ceramic (0.5%)
|
|
|
|
|
quartz (50 ppm)
|
|
|
|
|
in-system development
|
|
|
|
|
programmers
|
|
|
|
|
ISP
|
|
|
|
|
JTAG, debugWIRE
|
|
|
|
|
assembly language
|
|
|
|
|
host communication
|
|
|
|
|
bit timing
|
|
|
|
|
echo hello-world
|
|
|
|
|
IDE
|
|
|
|
|
boards
|
|
|
|
|
C libraries + IDE + bootloader
|
|
|
|
|
Interpreters
|
|
|
|
|
debugging
|
|
|
|
|
"printf"
|
|
|
|
|
processor
|
|
|
|
|
toolchain
|
|
|
|
|
sudo add-apt-repository ppa:terry.guo/gcc-arm-embedded
|
|
|
|
|
sudo add-apt-repository ppa:mobyfab/qstlink2
|
|
|
|
|
programmer
|
|
|
|
|
software
|
|
|
|
|
board
|
|
|
|
|
assignment
|
|
|
|
|
program your board to do something, with as many different programming languages and programming environments as possible
|
|
|
|
|
Input Devices
|
|
|
|
|
DDR, PORT, PINS
|
|
|
|
|
comparator
|
|
|
|
|
A/D
|
|
|
|
|
clocks (10% RC, 1% RC calibrated, .5% resonator, 50 ppm crystal)
|
|
|
|
|
bit timing
|
|
|
|
|
switch
|
|
|
|
|
magnetic field
|
|
|
|
|
temperature
|
|
|
|
|
bridges
|
|
|
|
|
light
|
|
|
|
|
step response
|
|
|
|
|
resistance, capacitance, inductance, position, pressure, proximity, tilt, acceleration, humidity, touchpad, multitouch, ...
|
|
|
|
|
loading
|
|
|
|
|
transmit-receive
|
|
|
|
|
sound
|
|
|
|
|
noise, regulator, bypass, A/D sleep, shielding, common mode,
|
|
|
|
|
acceleration, orientation
|
|
|
|
|
sonar
|
|
|
|
|
vibration
|
|
|
|
|
motion
|
|
|
|
|
force, loading
|
|
|
|
|
image
|
|
|
|
|
assignment
|
|
|
|
|
measure something: add a sensor to a microcontroller board that you've designed and read it
|
|
|
|
|
Interface and Application Programming
|
|
|
|
|
languages
|
|
|
|
|
device interfaces
|
|
|
|
|
user interfaces
|
|
|
|
|
graphics
|
|
|
|
|
Web
|
|
|
|
|
multimedia
|
|
|
|
|
math
|
|
|
|
|
assignment
|
|
|
|
|
write an application that interfaces with an input &/or output device
|
|
|
|
|
Output Devices
|
|
|
|
|
electrical safety
|
|
|
|
|
~1 mA: OK
|
|
|
|
|
~10 mA: shock, contraction
|
|
|
|
|
~100 mA: fibrillation
|
|
|
|
|
body: M ohm external, k ohm internal
|
|
|
|
|
skin depth: ~1/f^(1/2)
|
|
|
|
|
dielectric breakdown: ~kV/mm
|
|
|
|
|
supply capacitors
|
|
|
|
|
inductive flyback
|
|
|
|
|
protection diodes
|
|
|
|
|
connector polarization, orientation
|
|
|
|
|
PWM
|
|
|
|
|
75 ohm impedance
|
|
|
|
|
torque, power, efficiency, gearing
|
|
|
|
|
unipolar
|
|
|
|
|
bipolar
|
|
|
|
|
motor control
|
|
|
|
|
assignment
|
|
|
|
|
add an output device to a microcontroller board you've designed and program it to do something
|
|
|
|
|
Networking and Communications
|
|
|
|
|
purposes
|
|
|
|
|
location
|
|
|
|
|
parallelism
|
|
|
|
|
modularity
|
|
|
|
|
interference
|
|
|
|
|
serial
|
|
|
|
|
asynchronous
|
|
|
|
|
7: application (HTTP)
|
|
|
|
|
6: presentation (SSL)
|
|
|
|
|
5: session (RPC)
|
|
|
|
|
4: transport (TCP, UDP)
|
|
|
|
|
3: network (IP)
|
|
|
|
|
2: data link (MAC)
|
|
|
|
|
1: physical (PHY)
|
|
|
|
|
capacity
|
|
|
|
|
bandwidth * log_2 (signal/noise)
|
|
|
|
|
wired
|
|
|
|
|
single-ended, differential, powerline
|
|
|
|
|
open collector, open drain
|
|
|
|
|
transmission (pass) gate, tri-state
|
|
|
|
|
transmission line
|
|
|
|
|
waveguide
|
|
|
|
|
wireless
|
|
|
|
|
PCM: Pulse-Code Modulation
|
|
|
|
|
PPM: Pulse-Position Modulation
|
|
|
|
|
OOK: On-Off Keying
|
|
|
|
|
FSK: Frequency-Shift Keying
|
|
|
|
|
BPSK: Binary Phase-Shift Keying
|
|
|
|
|
QAM: Quadrature Amplitude Modulation
|
|
|
|
|
OFDM: Orthogonal Frequency-Division Multiplexing
|
|
|
|
|
FHSS: Frequency-Hopping Spread Spectrum
|
|
|
|
|
DSSS: Direct-Sequence Spread Spectrum
|
|
|
|
|
UWB: Ultra-WideBand
|
|
|
|
|
ALOHA
|
|
|
|
|
Master-Slave
|
|
|
|
|
Token Ring
|
|
|
|
|
TDMA: Time-Division Multiple Access
|
|
|
|
|
FDMA: Frequency-Divsion Multiple Access
|
|
|
|
|
CSMA: Carrier-Sense Multiple Access
|
|
|
|
|
CD: Collision Detection
|
|
|
|
|
CA: Collision Avoidance
|
|
|
|
|
1-persistent: transmit when clear
|
|
|
|
|
nonpersistent: random backoff
|
|
|
|
|
p-persistent: probability to transmit
|
|
|
|
|
CDMA: Code-Division Multiple Access
|
|
|
|
|
MIMO: Multiple-Input Multiple-Output
|
|
|
|
|
"PDMA": Physical-Division Multiple Access
|
|
|
|
|
detection, correction
|
|
|
|
|
block, convolution codes
|
|
|
|
|
parity, checksum, Hamming, Reed-Solomon, Turbo
|
|
|
|
|
source routing + network coordinates + back-pressure flow-control + synchronous communication
|
|
|
|
|
RF
|
|
|
|
|
oscillator, mixer, PA, LNA, IF, I/Q, demod, baseband, filters
|
|
|
|
|
Q, antenna gain, impedance matching
|
|
|
|
|
modules
|
|
|
|
|
single-chip
|
|
|
|
|
software radio
|
|
|
|
|
assignment
|
|
|
|
|
design and build a wired &/or wireless network connecting at least two nodes
|
|
|
|
|
Applications and Implications
|
|
|
|
|
assignment
|
|
|
|
|
plan and document a final project that integrates the range of units covered:
|
|
|
|
|
what will it do?
|
|
|
|
|
who's done what beforehand?
|
|
|
|
|
what materials and components will be required?
|
|
|
|
|
where will they come from?
|
|
|
|
|
how much will it cost?
|
|
|
|
|
what parts and systems will be made?
|
|
|
|
|
what processes will be used?
|
|
|
|
|
what tasks need to be completed?
|
|
|
|
|
what questions need to be answered?
|
|
|
|
|
what is the schedule?
|
|
|
|
|
how will it be evaluated?
|
|
|
|
|
projects can be separate or joint, but need to show individual mastery of all of the skills
|
|
|
|
|
where possible, you should make rather than buy the parts of your project
|
|
|
|
|
Project Development
|
|
|
|
|
assignment
|
|
|
|
|
what tasks have been completed, and what tasks remain?
|
|
|
|
|
what has worked? what hasn't?
|
|
|
|
|
what questions need to be resolved?
|
|
|
|
|
what will happen when?
|
|
|
|
|
what have you learned?
|
|
|
|
|
documentation during development
|
|
|
|
|
demand- vs supply-side time management
|
|
|
|
|
spiral development
|
|
|
|
|
Project Presentation
|
|
|
|
|
assignment
|
|
|
|
|
document a final project that integrates the range of units covered, answering:
|
|
|
|
|
what does it do?
|
|
|
|
|
who's done what beforehand?
|
|
|
|
|
what did you design?
|
|
|
|
|
what materials and components were used?
|
|
|
|
|
where did they come from?
|
|
|
|
|
how much did they cost?
|
|
|
|
|
what parts and systems were made?
|
|
|
|
|
what processes were used?
|
|
|
|
|
what questions were answered?
|
|
|
|
|
how was it evaluated?
|
|
|
|
|
what are the implications?
|
|
|
|
|
projects can be separate or joint, but need to show individual mastery of all of the skills
|
|
|
|
|
where possible, you should make rather than buy the parts of your project
|
|
|
|
|
present your final project, weekly assignments, and tutorials
|
|
|
|
|
201 - Functional Systems
|
|
|
|
|
Project Management (level 2)
|
|
|
|
|
synchronization
|
|
|
|
|
version control
|
|
|
|
|
Web development
|
|
|
|
|
blogs, wikis, content management systems
|
|
|
|
|
security
|
|
|
|
|
videoconference
|
|
|
|
|
protocols
|
|
|
|
|
codecs
|
|
|
|
|
Multipoint Control Unit (MCU)
|
|
|
|
|
clients
|
|
|
|
|
software
|
|
|
|
|
hardware
|
|
|
|
|
remote desktop
|
|
|
|
|
project?
|
|
|
|
|
project management programs
|
|
|
|
|
project management principles
|
|
|
|
|
demand- vs supply-side time management
|
|
|
|
|
serial vs parallel development
|
|
|
|
|
spiral development
|
|
|
|
|
bottom-up vs top-down debugging
|
|
|
|
|
hierarchy, modularity
|
|
|
|
|
total lifecycle perspective - PLM
|
|
|
|
|
assignment
|
|
|
|
|
build a personal site in the class archive describing you and your final project. Provide a project plan and describe the project management principles involved in your plan.
|
|
|
|
|
Atoms, Bits, Bits and Atoms
|
|
|
|
|
Design, Modeling and Simulation
|
|
|
|
|
Field of Design
|
|
|
|
|
Modeling
|
|
|
|
|
continuous and discrete math methods
|
|
|
|
|
Modelica
|
|
|
|
|
Solidworks simulation
|
|
|
|
|
Testing and characterization
|
|
|
|
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Making a Machine That Makes
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Invention, Intellectual Property, and Income
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invention
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intellectual property
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types
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utility (20 years from filing)
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design (14 years from grant)
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disclosure
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private
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public
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US: 1 year to file
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most international: can't file
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defensive
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provisional
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1 year to convert
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included in term
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full
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teaching
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specification, claims
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types
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composition
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method
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apparatus
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manufacture
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examination
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novel, non-obvious, useful
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(im)possibility
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genes, business processes, software
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Patent Cooperation Treaty (PCT)
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nationalization
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EPO
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precedence
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first to file vs first to invent
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maintenance
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litigation
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defense
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troll, NPE
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~ $100, $1k, $10k, $100k
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original works of authorship
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designs, software, circuits, mask works
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reproduce, modify, distribute, perform, display
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secured on creation
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notice of copyright
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registration
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lifetime + 70 years
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licenses
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open-source vs free
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establishment
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registration
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protection
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income
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financial
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cultural
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social
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sources
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licenses
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products
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consumables
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platforms
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advertising
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infrastructure
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services
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operation
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customization
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education
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research
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impact
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for-profit
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sole proprietor
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partnership
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limited liability company (LLC)
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corporation
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non-profit
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501(c)(3)
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funding
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VC
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angel
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friends & family
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loan
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bootstrap
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purchase commitment
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crowdsource
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lifecycle
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(failure of) business plan
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(need for) management team
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(problems in) scaling
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(pressure for) exit
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assignment
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Project Development
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assignment
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what tasks have been completed, and what tasks remain?
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what has worked? what hasn't?
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what questions need to be resolved?
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what will happen when?
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what have you learned?
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documentation during development
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demand- vs supply-side time management
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spiral development
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Project Presentation
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assignment
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document a final project that integrates the range of units covered, answering:
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what does it do?
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who's done what beforehand?
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what did you design?
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what materials and components were used?
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where did they come from?
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how much did they cost?
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what parts and systems were made?
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what processes were used?
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what questions were answered?
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how was it evaluated?
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what are the implications?
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projects can be separate or joint, but need to show individual mastery of all of the skills
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where possible, you should make rather than buy the parts of your project
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present your final project, weekly assignments, and tutorials
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